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+86.21.6027.8500
English
March 18-20, 2020
Shanghai New International Expo Centre

Choon Heung Lee

Chief Executive Officer, Jiangsu Changjiang Electronics Technology Co., Ltd

Dr. Choon Heung Lee (‘Choon Lee’) is currently the CEO of JCET. He was the Vice President for Advanced Packaging of Lam Research from March 2016 to September 2018. Prior to this, Dr. Lee served as the Chief Technology Officer of Amkor Technology, Inc from December 2013 to November 2015. Dr. Lee also served as an Executive Vice President for Worldwide Manufacturing Operations at Amkor Technology, Inc and President of Amkor Technology Korea from February 2015 to November 2015.

Dr. Lee also has written various research papers on various packaging technology related subjects and was granted 38 patents in Korea and 21 patents in the US. He holds a degree in Physics and a Masters of Statistical Physics from Korea University and a Masters of Solid State Physics and a Ph.D. in Theoretical Solid State Physics from Case Western Reserve University.

Speech Abstract:

Paradigm Inflection of Packaging Industry

These days the importance of advanced packaging has ever been emphasized because of cost of advanced Si node and high density integration. Also markets such as smartphone, big data, automotive, IoT and memory have looked for the solutions from advanced packaging for various applications. The solutions include the platform of 2.5D in conjunction with fan-out schemes, 3D TSV in memory and SiP. In particular, as 5G is coming up in 2019, specific design knowledge and expertise in RF and antenna are required with smarter ideas in advanced packaging which will lead to new applications like AI/VR/AR/hologram. In this talk, paradigm change in industry, advanced packaging solutions, and AI related manufacturing will be discussed.
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